Reflow Temperature Profile
SMD Type Reflow Temperature Profile (Available for lead free soldering)
 |
| ① | Preheat | 160〜180℃ 120sec. |
| ② | Primary heat | 220℃ 60sec |
| ③ | Peak | 260℃ 10sec. max. |
* The reflow temperature profile may vary depending on the product model, specifications and frequency range.
Refer to the individual product specifications for details.
Refer to the individual product specifications for details.
Reflow Temperature Profile (MEMS Devices)
The solder reflow profile shown in following figure is IPC/JEDEC J-STD-020 compliant and applies to all KDS MEMS packages; QFN, SOT23-5, 2.0x1.2 SMD, and WLCSP.
■Reflow Temperature Profile (Available for lead free soldering) |
■High Temperature Infrared/Convection Reflow Conditions IPC/JEDEC J-STD-020
| IPC/JEDEC Standard | IPC/JEDEC J-STD-020 |
|---|---|
| Moisture Sensitivity Level | Level 1 |
| TS MAX to TL (Ramp-up Rate) | 3℃/second Maximum |
| Preheat | |
| - Temperature Minimum (TS MIN) | +150℃ |
| - Temperature Typical (TS TYP) | +175℃ |
| - Temperature Maximum (TS MAX) | +200℃ |
| - Time (tS) | 60 - 180 Seconds |
| Ramp-up Rate (TL to TP) | 3℃/second Maximum |
| Time Maintained Above: | |
| - Temperature (TL) 60 - 150 Seconds | +217℃ |
| - Time (TL) | 60 - 150 Seconds |
| Peak Temperature (TP) 60 - 150 Seconds | +260℃ Maximum |
| Target Peak Temperature (TP Target) | +255℃ |
| Time within 5℃ of actual peak (tP) | 20 - 40 seconds |
| Max. Number of Reflow Cycles | 3 |
| Ramp-down Rate | 6℃/second Maximum |
| Time 25℃ to Peak Temperature (t) | 8 minutes Maximum |
Refer to datasheet for details of reflow profile specifications.