回流焊焊接温度描述
SMD类型回流焊焊接温度描述（支持无铅焊锡）
 |
| ① | 预加热 | 160〜180℃ 120sec. |
| ② | 正式加热 | 220℃ 60sec |
| ③ | 峰值 | 260℃ 10sec. max. |
* 回流焊焊接温度描述有可能根据相应机型、规格、频率范围的不
同而发生差异，详情请确认个别规格书。
同而发生差异，详情请确认个别规格书。
Reflow Temperature Profile (MEMS Devices)
The solder reflow profile shown in following figure is IPC/JEDEC J-STD-020 compliant and applies to all KDS MEMS packages; QFN, SOT23-5, 2.0x1.2 SMD, and WLCSP.
■Reflow Temperature Profile (Available for lead free soldering) |
■High Temperature Infrared/Convection Reflow Conditions IPC/JEDEC J-STD-020
| IPC/JEDEC Standard | IPC/JEDEC J-STD-020 |
|---|---|
| Moisture Sensitivity Level | Level 1 |
| TS MAX to TL (Ramp-up Rate) | 3℃/second Maximum |
| Preheat | |
| - Temperature Minimum (TS MIN) | +150℃ |
| - Temperature Typical (TS TYP) | +175℃ |
| - Temperature Maximum (TS MAX) | +200℃ |
| - Time (tS) | 60 - 180 Seconds |
| Ramp-up Rate (TL to TP) | 3℃/second Maximum |
| Time Maintained Above: | |
| - Temperature (TL) 60 - 150 Seconds | +217℃ |
| - Time (TL) | 60 - 150 Seconds |
| Peak Temperature (TP) 60 - 150 Seconds | +260℃ Maximum |
| Target Peak Temperature (TP Target) | +255℃ |
| Time within 5℃ of actual peak (tP) | 20 - 40 seconds |
| Max. Number of Reflow Cycles | 3 |
| Ramp-down Rate | 6℃/second Maximum |
| Time 25℃ to Peak Temperature (t) | 8 minutes Maximum |
Refer to datasheet for details of reflow profile specifications.