General cleaning solutions or ultrasonic cleaning may be used to clean our crystal products, but verification tests are recommended prior to use.

Tuning fork crystals resonate at frequency bands that are close to the washing frequency of ultrasonic cleaning machines and this may cause resonance deterioration in the crystal. Therefore the use of ultrasonic cleaning machines to clean tuning fork crystals should be avoided. After applying ultrasonic cleaning, the functionality of crystals should be verified by testing the performance of the end product.

<SMD crystal products>
Surface mount crystals are designed to be compatible with most automatic mounting processes, but some processes may exert excessive shock which may damage the crystal. Therefore test mounting of the crystal prior to mass production is necessary.
If there is a possibility that PCB may be warped, make sure the warping is not to such a degree that the crystal products' operating characteristics or soldering conditions will be negatively affected.
Ultrasonic welding of tuning fork crystals should be avoided as it may cause resonance destruction.

<Lead type>
When bending, forming, or mounting leaded crystal products, be careful not to put too much pressure on the glassed part of the base, as it may crack and negatively affect the crystals' performance.

<Crystal Resonators>
When excessive voltage is applied to crystal resonators, their performance may be affected or the crystal blank may be damaged. When handling the product, use the product within the specifications provided.

Negative resistance determines the tolerance margin of a circuit that oscillates the resonator. We recommend that the negative resistance be at least five times the standard series resistance for standard applications, and at least ten times the standard series resistance for automotive and safety applications.

<Crystal Oscillators>
C-MOS is used for internal circuit of crystal oscillators. To prevent latch-up phenomena or static electricity, take careful note.

Some crystal oscillators do not have internally connected bypass capacitors. When using the product, use a condenser with a good high frequency characteristic of  0.01 μ F between Vdd and GND(e.g.Ceramic chip capacitor)and connect it at the shortest possible distance. For details, refer to the specifications of each individual product.

<Crystal Filters>
When positioning two crystal filters together, assemble with the pairmark facing inward in the correct direction. If the filters are positioned in the wrong direction, the performance will be affected.

If the floating capacity of a PCB(on which a crystal filter is to be mounted)is too large, circuit tuning may be required to cancel out the excess floating capacity.

<Optical Quartz Products>
Our products are manufactured in a dust-free environment. To keep them clean and dust free, keep them in a clean environment after they are unpacked.