Daishinku Corporation (President: Sohei Hasegawa) announced the
development of multifunctional Temperature Compensated
Crystal Oscillator (TCXO) module, the DSA322MB. Samples
of the DSA322MB are available now.
KDS Daishinku has
been developing the multifunctional TCXO by building
peripheral circuits into a single chip die in the TCXO.
KDS Daishinku currently produces DSA322MA, 3.2x2.5mm
Multifunction-TCXO module, for W-CDMA, CDMA2000 and
other wireless applications. The mobile communication
technology has become increasingly advanced and there
has been more demand from the market to integrate more
functions into the TCXO. So the DSA322MB was developed
to provide more functionalities for the advanced mobile
The DSA322MB is the TCXO built in effective functions
for miniaturization and power saving design of mobile
The product is effective for the miniaturization
and power saving and expected for the big growing market
of mobile communication devices.
The DSA322MB is a 3225 size TCXO (3.2*2.5*1.0mm),
with a volume of 0.008cc. The DSA322MB has big
advantages of reducing the board space and providing
more precise power management with its integrated functions.
The followings are the integrated functions:
1) 3 outputs. (DSA322MA, the current model, has 2
The TCXO output is typically supplied to the PLL
circuit of the RF/Logic circuit through a buffer amplifier.
The DSA322MB has integrated 3 buffers in the single
die and provide less board space and less power consumption
compare to the circuit with the external buffers.
The first output has clipped sin wave for PLL circuit
in the RF sections and the output can be controlled
with the enabled/disabled pin for power saving.
The second and the third output have C-MOS logic
output and these can be used for the CPU/DSP in the
base band sections and any other logic circuits in the
The output level of those two CMOS outputs are independently
controlled with applying required supply voltage to
the output buffers and the logic level can be selectable
anywhere from +1.4V to +3.3V.
2) Temperature sensor output
DSA322MB has a temperature sensor output
for compensating temperature of PA/LCD on RF.
The output can be used for compensating
temperature of output level of PA and contrast of LCD.
Therefore, the conventional external
temperature sensing circuit (Temperature sensing ICs
or thermistors) are no longer needed with the temperature
sensor output from the DSA322MB and this provide a big
advantage of saving the board space and reduce the BOM
These above functions are integrated into the 10
terminals LCC package and 19.2MHz and 26MHz are prepared
as standard frequencies.
The followings are the advantages of using the DSA322MB
compare the circuit with a conventional TCXO:
1. Reducing current consumption and provide
long battery life(longer standby time)
The integrated buffers can be controlled independently
for more precise power management.
2. Miniaturizing the size of handsets
by reducing mounting area of devices.
Mounting area of devices can be reduced with the
integrated temperature sensor and build-in buffers.
Approximately 40% of mounting space can be saved with
the DSA322MB compare to the space with the conventional
The DSA322MB is lead-free and perfectly making consideration